Vertiv has announced new configurations of the Vertiv MegaMod HDX, a prefabricated power and liquid cooling infrastructure solution engineered for high-density computing environments, including artificial intelligence (AI) and high-performance computing (HPC) deployments.
Vertiv MegaMod HDX integrates direct-to-chip liquid cooling with air-cooled architectures to meet the intense thermal demands of AI workloads, supporting pod-style AI environments and advanced GPU clusters.
The new compact solution has a standard module height and a maximum of 13 racks and power capacity up to 1,25 MW; the combo solution has an extended-height design with a maximum of 144 racks, supporting power capacities up to 10 MW. Both can support rack densities from 50 kW up to more than 100 kW per rack.
The hybrid cooling architectures integrate direct-to-chip liquid cooling with air cooling for efficient, high-density thermal management, while the prefabricated modular designs enable accelerated deployment and allow customers to scale their data centers as demand grows.