The rapid growth of AI workloads is driving a fundamental shift in how data centres are designed, cooled, powered and operated.
In line with this, Vertiv, a global leader in critical digital infrastructure, recently announced the expansion of its end-to-end thermal chain with the availability of the Vertiv™ CoolChip CDU 2300 in Europe, Middle East and Africa (EMEA).
Designed for direct-to-chip and rear-door cooling applications, this liquid cooling technology supports straightforward, cost- effective deployment in data centre environments. Direct-to-chip liquid cooling delivers liquid coolant directly into the server and across high-power components like CPUs and GPUs. Coolant Distribution Units (CDUs) are an essential part of liquid-cooled server deployments, serving as the interface between facility cooling systems and IT hardware.
With its liquid-to-liquid heat exchange design, the Vertiv CoolChip CDU 2300 can circulate liquid to transfer heat more efficiently than traditional air cooling. This significantly improves thermal transfer performance, allowing data centres to support higher rack densities and compute-intensive workloads such as AI, high performance computing (HPC) and machine learning (ML) applications.
For organisations looking to deploy AI infrastructure, liquid cooling helps optimise energy use, enabling more available power to be directed towards computing resources while supporting efficiency objectives.
The Vertiv CoolChip CDU delivers 2.3 MW of cooling capacity in a compact footprint, offering one of the highest capacity-to-footprint ratios available in the market. Its design supports flexible placement, including in-row or in adjacent mechanical areas, helping operators reduce floor space requirements and the number of CDUs needed in large-scale, high-density deployments. This flexibility is particularly valuable for data centre operators seeking to introduce AI-ready infrastructure within existing facilities, allowing them to accommodate increasing compute densities without requiring extensive facility redesigns.
The integrated Vertiv™ CoolChip CDU controller allows temperature and flow to adapt to workload demands, while features such as redundancy, unit to unit communication, and remote monitoring help enhance system availability and simplify operations. This controller-level intelligence enables the CDU to operate in coordination with other elements of the thermal chain, enabling consistent thermal performance across the entire infrastructure.
As investment in AI, cloud and digital infrastructure accelerates across Africa, data centre operators face increasing pressure to support high performance computing while maintaining energy efficiency and operational resilience. The Vertiv CoolChip CDU 2300 provides a practical pathway to deploy advanced liquid cooling technologies that support AI workloads across multiple compute generations, optimise power utilisation and help organisations scale efficiently.
For more information on the Vertiv™ CoolChip CDU 2300 solution or other Vertiv infrastructure solutions, please visit Vertiv.com.