MediaTek has launched the Dimensity 9400, the company’s new flagship smartphone chipset optimised for edge-AI applications, immersive gaming and photography.
The Dimensity 9400 adopts MediaTek’s second-gen All Big Core design, integrating one Arm Cortex-X925 core operating over 3,62GHz, combined with 3x Cortex-X4 and 4x Cortex-A720 cores. This design offers 35% faster single-core performance and 28% faster multi-core performance compared to MediaTek’s previous generation flagship chipset, the Dimensity 9300.
Built on TSMC’s second-generation 3nm process, the Dimensity 9400 is up to 40% more power-efficient than its predecessor, allowing users to enjoy longer battery life.
With MediaTek’s 8th Generation NPU, the Dimensity 9400 boasts a number of industry firsts for exceptional generative AI performance; it is the first mobile chipset to offer on-device LoRA training, high-quality on-device video generation, and developer support for Agentic AI. To allow users to take advantage of the latest agentic and generative AI applications, the Dimensity 9400 offers up to 80% faster large language model (LLM) prompt performance while also being up to 35% more power efficient than the Dimensity 9300.
The Dimensity 9400 also integrates MediaTek’s new Dimensity Agentic AI Engine (DAE), which is designed to turn traditional AI applications into sophisticated agentic AI applications.
The 12-core Arm Immortalis-G925 delivers super immersive gaming experiences with up to 40% faster raytracing performance compared to the previous generation. The Dimensity 9400 also brings PC-level features to smartphones with opacity micromaps (OMM) support for realistic effects. The chipset’s powerful GPU also offers 41% peak performance boost with up to 44% power savings compared to the Dimensity 9300, allowing users to game for longer. Additionally, the Dimensity 9400 supports. HyperEngine technology for super resolution and impressive picture quality, which is co-developed by MediaTek and Arm Accurate Super Resolution (Arm ASR).