Vertiv has announced the expansion of the Vertiv CoolChip CDU (coolant distribution units) family with the launch of the Vertiv CoolChip CDU 70, Vertiv CoolChip CDU 100 and Vertiv CoolChip CDU 600 models in Europe, the Middle East and Africa (EMEA).
The new models are designed to suit retrofit or greenfield data centre environments, with models including in-rack and row-based configurations, and liquid-to-air and liquid-to-liquid technologies.
Vertiv CoolChip CDU 70 is an in-row, liquid-to-air coolant distribution unit that enables a fast, cost-effective entry into liquid cooling for data centres retrofitting existing environments or deploying new infrastructure. Designed to utilise existing thermal infrastructure, this liquid-to-air CDU is ideal for facilities looking to deploy liquid cooling capacity without requiring major infrastructure changes.
The system delivers up to 70 kW of cooling capacity and is designed for agility and scalability, helping to reduce secondary fluid network complexity and infrastructure footprint. Its integrated controller supports real-time monitoring, group control and unit-to-unit communication, for coordinated thermal performance, simplified management, and efficient scaling across multiple racks.
Vertiv CoolChip CDU 100 brings powerful liquid-to-liquid in-rack cooling performance, giving data centres a secure and space-efficient solution for high-density workloads. Ideal for operators to introduce or expand liquid cooling deployments one rack at a time, supporting incremental growth or AI pilot programs without the need for large-scale infrastructure changes. With 100 kW of cooling capacity in a 4U form factor and a large-surface heat exchanger engineered for low approach temperatures, Vertiv CoolChip CDU 100 enables optimal heat transfer.
An integrated controller provides monitoring and control capabilities to streamline operations and enhance visibility. Built-in filtration and precise temperature control within ±1°C help maintain fluid quality and thermal stability, while the physical separation of facility and IT loops supports secure, efficient system management in mission-critical environments.
Vertiv CoolChip CDU 600 is an in-row, liquid-to-liquid model delivering robust, scalable liquid cooling capacity for high-density AI and HPC deployments. The 600 kW system is designed to meet the demands of hyperscale and colocation environments, supporting in-row configurations and integrating easily into raised floor or retrofit installations. Its design, including top or bottom piping connections and available internal manifolds, streamlines infrastructure planning and speeds implementation.
With redundant pumps, advanced monitoring for temperature and fluid quality, and a flexible approach to deployment, Vertiv CoolChip CDU 600 offers reliability, visibility, and performance for customers scaling liquid cooling across broader IT environments.